Media

“ESiP” Creates Reliable System-in-Package Demonstrators and Receives the 2013 ENIAC JU Innovation Award

27 Nov 2013

Barcelona: The ENIAC Joint Undertaking announced that the project “Efficient silicon multi-chip System-in-Package integration – reliability, failure analysis and test... View Article

ENI2 New Initiative to Establish Technology Roadmaps for Mid- and Long-term Cooperative R&D Projects in Nanoelectronics in Europe

21 Jan 2013

Paris, January 21, 2013 – AENEAS, the association bringing together European R&D players in nanoelectronics, announced today the launch of... View Article

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