RESIST: design methods vital for next generation electronic systems
15 Mar 2018Paris, 15 March, 2018 – The RESIST (RESILient Integrated SysTems) project, part of the European CATRENE funding programme managed by... View Article
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CISTERN to improve image capture sensors for UHD
22 Feb 2018Paris, 22 February, 2018 – The CATRENE funding programme, managed by AENEAS, today highlights the CISTERN project. The multi-disciplinary partners... View Article
MoreDr. Sabine Herlitschka – new Chair of ECSEL Joint Undertaking
15 Feb 2018The Governing Board of the ECSEL Joint Undertaking is happy and proud to announce the election of Dipl-Ing Dr Sabine... View Article
MoreTRACE – faster, affordable innovation in automotive electronics
08 Feb 2018Paris, February 8, 2018 – The EUREKA CATRENE funding programme, managed by AENEAS, today highlights the TRACE project. TRACE aims... View Article
MoreIndustry Associations- First ECS-SRA on Full Value Chain
25 Jan 2018PRESS RELEASE Industry associations unveil first electronic components & systems (ECS) strategic research agenda spanning the full value chain... View Article
MoreDISPERSE: solutions for MRI scanning of patients with multiple implants
18 Jan 2018Paris, January 18, 2018. The PENTA funding programme, managed by AENEAS, today highlights the DISPERSE project. This project aims to... View Article
MoreH2020 project NEREID – roadmap on future of European Nanoelectronics
19 Dec 2017H2020 project NEREID presents the first version of its roadmap on the future of European Nanoelectronics Hannover/Grenoble/Brussels … December 19,... View Article
MoreInnovation Award 2017 won by CATRENE Project MobiTrust
07 Dec 2017CATRENE Project MobiTrust wins 2017 Innovation Award Paris, 7 December 2017 – MobiTrust wins the 2017 CATRENE Innovation Award! MobiTrust project provides solutions... View Article
MorePENTA Call 3 launch at EFECS
04 Dec 2017PENTA CALL 3 Launch Paris, 4 December 2017 – AENEAS is pleased to announce the third call of the... View Article
MoreESiP wins 2013 ENIAC JU Innovation Award
27 Nov 2013Barcelona: The ENIAC Joint Undertaking announced that the project “Efficient silicon multi-chip System-in-Package integration – reliability, failure analysis and test... View Article
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