ID2PPAC pursues the objective to demonstrate that Performance Power Area and Cost (PPAC) requirements for the 2nm node generation of leading-edge logic technology can be achieved. It consolidates and integrates 2nm technology solutions which have been identified and evaluated in its predecessor IT2.

To continue the Moore’s law trajectory to the 2nm node, while meeting PPAC requirements, the combination of further advancements in EUV lithography & masks, 3D device structures, materials and metrology is required. The strength of the project pivots on the focused engagement of leading expert partners in these key interlocking areas and a shared pilot line.

The ID2PPAC project is expected to enable IC-fabs to do EUV-based, single-print, High Volume Manufacturing for the 2nm node by 2025. This technology evolution is driven by the growing demand for compute power, which increases more than exponentially with time. This has made the world migrate from 1 billion interconnected devices in the “PC era” to 10 billion in the “Mobile + cloud era” to the future “Intelligence era”, in which there will be over 100 billion intelligent connected devices. To enable this growth, the semiconductor industry is continuously pursuing technology innovations to realize this progress, as has been predicted by Moore’s Law, and will continue to do so.

Nowadays, next to pure geometric scaling of 2D features, additional approaches in which new devices, materials, 3D and system architecture aspects are combined to increase the compute power density. In the ID2PPAC project, in addition to advancing Lithographic, Metrology, Process and Mask equipment, these advanced semiconductor Process technology developments are covered concurrently to provide the relevant equipment demonstrators to enable 2nm node process technology.

The impact of ID2PPAC is expected to be huge, as the work will enable the semiconductor industry to keep pace with Moore’s law, meeting the PPAC requirements for 2nm technology. The project will also help to expand Europe’s technological capacity to act in this field, which is crucial for digitization, (edge) AI and for solving national, European, and global societal challenges, and will strengthen the consortium of leading European companies and institutes active in this sector. Moreover, the results of the ID2PPAC project are crucial to further extend the technological leadership of the consortium of leading European companies and institutes, and to maintain Europe’s sovereignty in the Semiconductor Equipment industry in a worldwide and highly competitive landscape.

ECSEL Call 2020

Start date: 06/2021

Number of partners: 27

Number of countries: 8

Total investment: M€ 107

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