After a very successful 2023 edition, AENEAS, EPoSS, INSIDE and The European Chips Skills Academy (ECSA) project have joined forces... View Article
MoreThe Xecs Call 4 in the area of Electonic Components and Systems opened today, as of 4 June 2024! Project... View Article
MoreCurrent metrology tools are often too monolithic and can’t be reconfigured to various and fast-changing needs. The Wafer Metrology Centre... View Article
MoreDespite hospital early warning tools many upcoming disorders are not detected in a timely fashion and frequently requiring costly none-reimbursed... View Article
MoreThe ECS Brokerage Event 2024, held in Brussels on February 20-21, gathering more than 500 participants, marked a significant milestone... View Article
MoreOn February 6th 2024, the Chips Joint Undertaking (Chips JU) launched three calls for proposals for the non-initiative part of... View Article
MoreThe three Industry Associations AENEAS, EPoSS and INSIDE released the final version of the seventh edition of the Electronic Components and... View Article
MoreThere were big announcements and a large attendance at the Chips Joint Undertaking (JU) Launch Event in Brussels, 30 November... View Article
MoreWe are glad to share the vibes of the amazing week at the Summer School “Fascinating Electronics for a Cool... View Article
MoreWe proudly present the draft of the seventh edition of the Electronic Components and Systems (ECS) Strategic Research and Innovation... View Article
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