Vision, Identification, with Z-sensing Technologies and key Applications

VIZTA project aims at developing innovative technologies in the field of optical sensors and laser sources for short to long-range 3D-imaging and to demonstrate their value in several key applications including automotive, security, smart buildings, mobile robotics for smart cities, and industry4.0.

The key differentiating Silicon sensing technologies developed during VIZTA are:

  • innovative Silicon single photon avalanche diode technology based on a dedicated 12-inch process and intended for direct Time-of-Flight applications,
  • pioneering lock-in pixel technology based on an advanced 12-inch CMOS process and intended for indirect Time-of-Flight applications:
  • ground-breaking and cost-effective 12-inch wafer level optics including the development of NIR bandpass thin-film filters, no angle-shift NIR bandpass filters, RGB+Z on-chip filtering solution, microlenses solution for both depth sensing and RGB+Z.
  • complex RGB+Z pixel architectures for multimodal 2D/3D imaging,

For short-range depth map applications, multi-channel VCSEL sources including wafer-level GaAs optics and associated high-speed driver are developed and validated within this project.

For medium and long range automotive LiDARs, VIZTA supports the development of:

  • high performance laser sources for medium and long range,
  • full solid-state laser beam steering with optical-phased-array for medium range, MEMS micromirrors for long range,
  • cost-effective InGaAs photodiodes for long range LiDAR detector.

The developed differentiating technologies serve as a basis for the design of innovative 3D imaging sensors products with the following porotypes demonstrators:

  • High resolution Time-of-Flight ranging sensor module with integrated VCSEL, drivers, filters and optics,
  • Very High resolution (VGA min) depth camera sensor with integrated filters and optics.

Technology developments of sensors and emitters are carried out by leading semiconductor product suppliers (STMicroelectronics, Philips, III-V Lab) with the support of equipment suppliers (Amat, Semilab, Menapic) and major RTO, the CEA Leti.

The following markets will be directly addressed during VIZTA through 6 applications demonstrators:

  • automotive in-cabin with two leading end-users, IEE that benefit from DFKI skills in artificial intelligence, Ficomirrors that will focus on driver monitoring,
  • smart building, also targeted by IEE,
  • security, with Idemia OEM collaborating with CEA List that will bring its expertise in neural networks,
  • automotive medium-range LiDAR, led by Ibeo with a strong partnership with ST, III-V Lab and Leti,
  • automotive long-range LiDAR, pursued by Veoneer with the support of component integrators (Lumibird, Beamagine) and Polytechnic University of Catalonia,
  • industry 4.0 with a demonstrator developed in collaboration between two SMEs, Integrated Systems Development and BCB Informatica, with the support of the Institute of Electronics and Computer Science in Latvia,
  • mobile robotics for smart cities, with FCC leader in citizen services as technology assessor and Eurecat Technology Centre that bring its expertise in robotics.

A large effort will be done for the project results exploitation under leadership of Alter Technology.

The project is divided in 3 development WPs, a dedicated Dissemination & Exploitation WP, and a management WP.

VIZTA consortium brings together 25 partners from 9 countries in Europe: France, Germany, Spain, Greece, Luxembourg, Latvia, Sweden, Hungary, and United Kingdom.

VIZTA project is a prime opportunity for positioning Europe in a leadership position for advanced imaging sensors, laser sources, and systems. This will be achieved through the mastering of the complete value chain from silicon and III-V material technologies up to end-users. VIZTA will obviously strengthen innovation capacity, competitiveness and sustainability of its consortium and positively impact European economy by:

  • enabling large volume productions in Europe, of imaging sensors having the capacity to significantly load the 12-inch wafer line at ST-Microelectronics, of laser sources with two important players (Philips, III-V Lab), thus maintaining and creating employment,
  • targeting fast growing markets strategic for European industry, including automotive, security, robotics, smart buildings and Industry 4.0, with the delivery of key demonstrators.
  • forging/reinforcing links between the large companies and the 5 SMEs embedded in the project to explore new markets with early provision of state-of-the-art 3D sensors,
  • securing Intellectual Properties in disruptive innovation domains,
  • enabling equipment suppliers to keep leadership and market share.

ECS Strategic Research Agenda focus areas:


Transport and smart mobility

ECSEL Call 2018

Start date: 04/2019

Duration: 42 months

Project coordinator:

Laurent Dugoujon



Number of partners: 23

Number of countries: 9

Total investment: M€ 21

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