On 28 October 2026, ePicture This 2026 | AENEAS Technical Day brought together nearly 80 participants from across the European Electronic Components and Systems (ECS) ecosystem at Eindhoven University of Technology (TU/e), the Netherlands. Dedicated to the latest advances in imaging technologies, the event offered a full day of insightful keynotes, technical presentations and networking, exploring innovations from image processing and sensing to real-world applications.
Co-organised by core partners from the Xecs projects ELEVATION, ENTERTAIN, together with AENEAS, the event provided a platform for researchers, technology developers and industry representatives to exchange knowledge, showcase emerging technologies and explore opportunities for collaboration.
The programme was structured around three interconnected dimensions of imaging technology: Processing, Capturing and Application, reflecting the broad spectrum of innovation shaping the future of intelligent imaging systems.
Connecting Research, Industry and Collaborative Innovation
The day opened with a welcome address by Caroline Bedran, AENEAS Director General, followed by opening remarks from Marcel Dijkema (Sioux Technologies), Egor Bondarev (Eindhoven University of Technology) and Klaas Jan Damstra (Grass Valley).
The opening session highlighted the importance of bringing together industrial expertise, academic research and collaborative innovation to address emerging technological challenges.
For AENEAS, the Technical Day reflects its commitment to strengthening Europe’s ECS ecosystem by facilitating knowledge exchange, connecting stakeholders and supporting the development of collaborative research and innovation initiatives.
As a partner in the Chips Joint Undertaking and the organisation operating the Eureka Cluster Xecs, AENEAS plays an active role in fostering cooperation across the European electronics value chain and supporting innovation from research to industrial application.
“Innovation in ECS thrives when research and industry come together. Through initiatives such as ePicture This, AENEAS aims to create opportunities for experts to exchange knowledge, discover complementary expertise and build connections that can lead to future collaborative innovation” – said Caroline Bedran.
Highlighting the importance of the event for the technology community, Marcel Dijkema also emphasised the value of connecting different disciplines and perspectives: “What makes ePicture This particularly valuable is the opportunity to bring together experts working on different parts of this technological chain. By sharing practical experiences, research results and new ideas, we can better understand the challenges ahead and accelerate the development of innovative solutions.”
Three Keynotes Exploring the Future of Imaging
Three keynote presentations provided the framework for the day’s technical discussions, offering complementary perspectives on the processing, capturing and application of imaging technologies.
PROCESSING: From Visual Data to Situational Awareness
The first keynote, “Situational Awareness: Inside Out with CGI Indoor Explorer”, was delivered by Bart-Peter Smit and Max van Schendel from CGI Nederland B.V. Their presentation explored how computer vision, visual Simultaneous Localisation and Mapping (SLAM), and sensor fusion can improve situational awareness in complex indoor environments. Through the CGI Indoor Explorer solution, they demonstrated how multiple users and sensors can contribute to a shared operational picture in real time, even in environments where GPS is unavailable and reliable maps do not exist. The presentation illustrated the potential of advanced imaging and collaborative sensing technologies to support emergency responders and improve decision-making in challenging conditions.
CAPTURING: Pushing the Boundaries of CMOS Image Sensors
The second keynote, “Is The Perfect CMOS Image Sensor Available Today?”, was delivered by Albert Theuwissen, Harvest Imaging, a recognised expert in solid-state imaging technologies. Despite the remarkable performance achieved by modern CMOS image sensors, Albert Theuwissen challenged the idea that sensor technology has reached its limits. Examining key performance parameters, including quantum efficiency, dynamic range and noise, he highlighted the remaining technical challenges and opportunities for further improvements. His presentation offered a valuable perspective on the continued importance of fundamental sensor research in enabling future generations of imaging applications.
APPLICATION: Towards More Robust Radar Imaging
The third keynote, “Towards Robust Imaging with Radars”, was presented by Tunc Alkanat, NXP Semiconductors. Focusing on radar sensing and intelligent perception, the presentation explored how advances in signal processing, machine learning and embedded computing can improve the reliability of radar systems in complex and dynamic environments. Beyond established automotive applications, the keynote highlighted the growing potential of radar technologies in robotics and autonomous systems, demonstrating how intelligent sensing can contribute to more robust and reliable perception.
Technical Presentations Showcasing Emerging Research and Innovation
Alongside the keynotes, the programme featured ten technical presentations from universities, research organisations and industrial innovators, covering a wide range of technologies and applications.
The morning sessions explored advances in 3D reconstruction, computer graphics and artificial intelligence.
Yasaman Kashefbahrami (Eindhoven University of Technology) presented “Seeing the Unseen: Real-Time 3D World Reconstruction: From Static Scenes to Dynamic SLAM”, examining how advanced SLAM techniques can enable more reliable reconstruction of dynamic environments, particularly in challenging scenarios such as disaster response.
Anthony Cioppa (University of Liège) addressed the convergence of neural rendering and classical computer graphics, while Christiaan Viviers and Francisco Caetano (Eindhoven University of Technology) explored the use of generative AI to create application-tailored synthetic imaging data.
Orlando Moreira (Snap B.V.) introduced NeuronFlow, focusing on low-power, low-latency AI processing for responsive augmented reality applications.
The afternoon programme continued with innovations in image sensing, materials and advanced inspection technologies.
Stijn Awouters (Eyeo) presented the development of a filter-free colour splitting image sensor, from its initial concept to silicon implementation and first results.
Lucia Crocetto (Delft University of Technology) explored low-temperature integration of SiGe on silicon using aluminium-induced crystallisation, highlighting its potential for advanced optical and electronic sensors.
The final technical session focused on innovative imaging approaches and specialised applications.
Oksana Manyuhina (Sioux Technologies) introduced the mathematical foundations of event-based vision, offering a different perspective on how visual information can be captured and processed.
Dávid Tátrai (3DHISTECH) presented advanced measurement techniques in digital pathology, demonstrating the importance of precision imaging in medical applications.
Finally, Till Dreier (Excillum) discussed high-resolution 3D X-ray inspection of advanced semiconductor packaging devices, illustrating the growing role of imaging technologies in ensuring the quality and reliability of increasingly complex electronic components.
Together, these contributions demonstrated the diversity of imaging innovation across the European ECS ecosystem, from fundamental research and enabling technologies to industrial applications.
Recognising Excellence in Technical Innovation
A highlight of the event was the presentation of the Best Technical Presentation Award, recognising an outstanding contribution to the day’s technical programme.
Congratulations to Yasaman Kashefbahrami from Eindhoven University of Technology, winner of the Best Technical Presentation Award! Her presentation, “Seeing the Unseen: Real-Time 3D World Reconstruction: From Static Scenes to Dynamic SLAM”, explored the potential of advanced 3D reconstruction techniques to improve situational awareness in dynamic and unpredictable environments.
The research, associated with the Xecs project ELEVATION, addresses important challenges in enabling robots and first responders to navigate hazardous environments, identify obstacles and reconstruct spaces that may be difficult or unsafe for humans to access.
The award highlighted the importance of translating advanced research into technologies with meaningful practical applications.
Building Connections for Future Innovation
Beyond the technical programme, ePicture This 2026 offered valuable opportunities for networking and informal exchanges between participants from industry, academia and the wider innovation ecosystem.
The discussions throughout the day reinforced the importance of cross-disciplinary collaboration in addressing increasingly complex technological challenges, particularly as imaging systems become more intelligent, interconnected and application-driven.
By bringing together expertise from across the imaging value chain, the event contributed to AENEAS’ broader mission of strengthening Europe’s competitiveness in Electronic Components and Systems and fostering collaborative innovation.
On behalf of co-organisers, AENEAS warmly thanks all keynote speakers, technical presenters, participants and co-organisers for contributing to the success of ePicture This 2026. Special thanks go to Eindhoven University of Technology, Sioux Technologies and Grass Valley for their collaboration and commitment to making this Technical Day possible.
We look forward to continuing these exchanges and building on the connections established in Eindhoven to support future research and innovation across Europe’s ECS community.