As preparations for the Chips JU Work Programme 2027 move forward, stakeholders from across the European Electronic Components and Systems (ECS) community are invited to contribute to two upcoming Online Consultation Workshops, taking place on 5 October 2026.
The interactive sessions will provide an opportunity to discuss industrial needs and technology gaps, provide feedback on draft Call concepts, and contribute to shaping potential topics for the Chips JU Work Programme 2027.
Session 1: Co-Packaged Optics for Advanced Data Communication (IA)
09:00–10:30 CEST
The session will focus on energy-efficient, high-throughput and low-latency data links for AI and HPC infrastructure, with discussions covering:
- Optical engine and transceiver integration
- Fiber-to-chip coupling and thermal management
- Test and reliability qualification for scale-up, scale-out and optical circuit switching
Session 2: System-Level Design for Heterogeneous Integration
10:30–12:00 CEST
This session will address key system-level design gaps towards 2030 and their role in strengthening European technological sovereignty. Topics will include:
- Early and holistic evaluation of complex architectures, including security, flexibility and cost trade-offs
- Scalable abstraction from high-level exploration to subsystem refinement
- Full traceability from architectural requirements to final design decisions
Participants are invited to provide feedback on the relevance and ambition of the draft topics, propose new ideas and identify critical innovation gaps, while exchanging with experts from the photonics, packaging and EDA communities.
Join the consultation and contribute your expertise to the preparation of the Chips JU Work Programme 2027. More information and registration here.