ECS Summer School 2026: Inspiring Europe’s Next Generation of Microelectronics Talent
From 23 to 28 August 2026, the fourth edition of the ECS Summer School brought together 40 selected STEM students studying at universities across Europe in Bertinoro, Italy, for an intensive week dedicated to Electronic Components and Systems (ECS).
Hosted for the third time at the University Residential Centre of the University of Bologna, this Summer School offered participants a unique opportunity to explore the complete ECS value chain – from semiconductor fabrication and integrated circuit design to system integration, digital systems and embedded intelligence.
Over the course of the week, leading experts from industry, universities and research and technology organisations shared their knowledge and experience through lectures, demonstrations, practical activities and career discussions. Students did not simply learn how technologies work: they fabricated and programmed a thermal sensor, experimented with MEMS, built a connected weather station and exchanged directly with professionals working across Europe’s semiconductor ecosystem.
The programme was structured around four main themes: Semiconductor Technology, Integrated Circuit Design, Integration, and Digital Systems & Embedded Intelligence.
The scene for the week was set by Patrick Cogez, AENEAS, who welcomed the participants and introduced the programme and the broader context of Europe’s ECS ecosystem. The ECSA Student Ambassadors also played an active role in welcoming the students, breaking the ice and helping create a collaborative atmosphere from the very beginning.
A European initiative supported by the ECS community
The ECS Summer School 2026 was co-organised by AENEAS, EPoSS, INSIDE Industry Association, SEMI Europe on behalf of the European Chips Skills Academy (ECSA), and ABGi France on behalf of IPCEI ME/CT.
This fourth edition was made possible with the support of its Gold Sponsors: ams OSRAM, Bosch, NXP Semiconductors and ZEISS.
Their contribution went well beyond supporting the organisation of the event. Throughout the week, industry representatives shared their expertise, presented technologies and engaged directly with participants. Dedicated Company Corners provided further opportunities for students to meet companies’ representatives, ask questions and discover career opportunities within the European semiconductor and ECS ecosystem.
Semiconductor Technology: from fabrication to the technologies of tomorrow
The first full day focused on the foundations of semiconductor technology and on understanding how a chip is actually made.
Following a welcome by Enrico Sangiorgi from the University of Bologna, Frans List from ASML opened the technical programme with a session on Moore’s Law, before Yannick Le Tiec from CEA-Leti took students through semiconductor fabrication. The programme then moved beyond conventional scaling. Laurent Rubaldo from LYNRED introduced More than Moore technologies through the example of infrared sensors, while the team from ESIEE Paris presented thermal sensor fabrication. In the afternoon, theory became practice. Olivier Français, Patrick Poulichet and Lionel Rousseau from ESIEE Paris led students through a virtual clean-room visit and a thermal sensor fabrication serious game, allowing them to experience the successive stages involved in semiconductor manufacturing in an interactive format. The day concluded by looking towards emerging technologies. Luca Selmi from the University of Modena presented steep-slope transistors, while Kilian Gruel from Quobly introduced the challenge of building a silicon quantum computer.
From established semiconductor manufacturing processes to quantum computing, Day 1 gave students a broad perspective on both the foundations and the future of semiconductor technology.
Integrated Circuit Design: from digital design to real-world applications
Tuesday shifted the focus from semiconductor technology to Integrated Circuit design, showing students how devices are designed and ultimately transformed into solutions for real applications.
Valentina Nardone from STMicroelectronics introduced digital design, followed by Davide Rossi from the University of Bologna/Fondazione Chips-IT, who explored the rapidly developing field of open-source IC design. The morning continued with Mikael Östling from KTH Royal Institute of Technology, who addressed Power IC technology and design, before Giulio Ricotti from STMicroelectronics demonstrated how electronics and integrated circuits are used inside ultrasound machines for echography. In the afternoon, students returned to the thermal sensors introduced on Day 1. During a two-hour hands-on session led by ESIEE Paris, they characterised and programmed their sensors, moving another step from semiconductor fabrication towards a functioning electronic device. Dušan Radović and Victor Morini from Bosch Sensotech then introduced MEMS technology, providing the bridge towards the following day’s focus on integration. Students also had opportunities to interact with representatives from Bosch, ams OSRAM, NXP and ZEISS through the Company Corners, discovering technologies and discussing directly with professionals from the semiconductor industry.
After a packed technical programme, the group explored its surroundings with a guided tour of Bertinoro, combining learning with another opportunity to strengthen the connections formed during the week.
Integration: turning components into systems
Wednesday was dedicated to integration: understanding how individual components, sensors and technologies come together to form functional and reliable systems.
The morning began with Alena Weber from Bosch, who presented ASIC design for MEMS. Theresa Seeholzer from Infineon Technologies then introduced a different perspective on electronics through bio-based devices and the circular economy. Anna Krzyzanowska from the Danish Technological Institute presented printed technologies, while Xavier Muñoz from IMB-CNM-CSIC explored integrated microsystems for One Health, illustrating the potential of microelectronics and microsystems in health-related applications. The afternoon was once again highly practical, with a hands-on MEMS activity led by the Bosch team, followed by a demonstrator session where students could see, handle and experiment with concrete examples of the technologies discussed during the lectures.
The technical programme was complemented by a dedicated career testimonies session. Young professionals and researchers including Alena Weber, Anja Schulz, Raminta Mazetyte, Rosalia Rodriguez Rodriguez, Theresa Seeholzer, Vincent Kenbeek and Luigi Capogrosso shared their career paths and experiences. Their testimonies highlighted the diversity of opportunities available within the microelectronics sector and encouraged students to build careers based not only on technical expertise, but also on curiosity, creativity, openness and professional networks.
Digital Systems & Embedded Intelligence: from connected devices to Physical AI
Thursday completed the journey through the ECS value chain by moving from individual devices and integrated systems towards Digital Systems and Embedded Intelligence.
The day was introduced by Paolo Azzoni from INSIDE Industry Association, followed by Markus Tauber from Research Studios Austria, who presented Cyber-Physical Systems of Systems. Students then put these concepts into practice by building their own connected weather stations, supervised by Pal Varga and Csaba Hegedűs from Budapest University of Technology and Economics. The exercise continued in the afternoon as participants added new functionalities to their systems and connected physical sensing with digital technologies. Jan van Deventer from Luleå University of Technology broadened the perspective with a session on Engineering Systems of Systems, while Michele Magno from ETH Zürich concluded the technical programme with a look at the next frontier: edge intelligence and Physical AI for next-generation mobile robotics.
After four intensive days of lectures and hands-on work, the participants ended the day with a visit to a local winery and a networking dinner – an opportunity to continue discussions in a more informal setting and celebrate the community that had formed during the week.
Looking beyond technology: geopolitics, Europe and the future of ECS
The final morning invited students to take a broader view of the semiconductor industry and consider not only technology, but also the geopolitical environment shaping Europe’s ECS sector.
Moderated by Stefano Ramundo Orlando from SEMI Europe, the student debate addressed issues including semiconductor supply chains, technological sovereignty, export controls and the strategic choices facing Europe. After spending the week learning directly from experts working across the semiconductor value chain, students were now invited to formulate and defend their own perspectives on the future of the sector.
The programme concluded with a graduation ceremony and closing remarks from Roberto Zafalon of STMicroelectronics and Caroline Bedran of AENEAS, followed by feedback from the students themselves.
More than a Summer School
Over five intensive days, the ECS Summer School took its 40 participants on a journey from silicon and semiconductor fabrication to IC design, MEMS and system integration, connected devices, edge intelligence and Physical AI. But the experience went well beyond the technical programme.
Students studying STEM subjects at universities across Europe had the opportunity to learn directly from engineers, researchers and experts from organisations including ASML, CEA-Leti, LYNRED, STMicroelectronics, Bosch, Infineon Technologies, KTH Royal Institute of Technology, ETH Zürich, ESIEE Paris, the University of Bologna and many others.
Through practical activities, Company Corners, career testimonies, informal discussions and social moments, they were also able to discover the diversity of careers available within the European ECS ecosystem and build connections with both professionals and fellow students.
The ECS Summer School ultimately reflects a shared ambition among its organisers, speakers and industrial supporters: to give the next generation of European STEM talent the knowledge, inspiration and connections needed to become part of Europe’s future in microelectronics.
