The IMAGINATION Penta-Euripides² project delivered major advances in image sensors, optical and camera architectures, and high-speed imaging systems, addressing demanding applications in live television broadcasting and machine vision for semiconductor inspection. The project was carried out by a European consortium bringing together leading industrial and research players across the imaging value chain, including Caeleste, Delft University of Technology, Euresys, Grass Valley Nederland BV, KLA, Melexis NV, Teledyne Adimec Advanced Image Systems BV and intoPIX SA.
Together, the consortium successfully translated advanced research into validated, near-market technologies.
New camera architectures and enhanced imaging for broadcast
To support growing media consumption and increasingly complex production workflows, IMAGINATION introduced significant innovations in broadcast imaging, driven by close collaboration between camera manufacturers, compression specialists and system architects:
-
A new two-sensor camera architecture using an optical white-light splitter enabled both double-speed slow motion (from 6× to 12×) and an extended dynamic range of at least two additional F-stops.
-
Depth maps generated from single images were demonstrated, enabling software-based depth-of-field control and new creative options in video processing.
-
ticoRAW compression was successfully implemented in a broadcast camera, enabling efficient transmission to cloud and edge processing environments while preserving visual quality.
These developments improve image quality, flexibility and productivity in live broadcast workflows and prepare next-generation cameras for cloud-enabled production.
High-speed machine vision for advanced semiconductor packaging
IMAGINATION addressed the rapidly increasing complexity of semiconductor components and advanced packaging, where inspection speed, accuracy and data handling are critical:
-
Sustained imaging performance was doubled to 10 Gpixels per second, enabled by a complete 100 Gb/s ecosystem spanning cameras, frame grabbers and vision processing platforms.
-
New platforms support very high-resolution imaging (up to 100 megapixels) at high frame rates, enabling detection of extremely small defects required for 100% inspection.
-
3D imaging capabilities, including Time-of-Flight approaches with embedded image processing, were demonstrated, supporting reliable absolute distance measurements.
-
Smarter data handling was achieved through advanced compression and the world’s first implementation of the Generic Data Container (GenDC) over CoaXPress, enabling standardized transport of images, metadata and auxiliary data across the inspection chain.
These results enable faster, more reliable inspection in semiconductor manufacturing environments driven by AI, HPC and advanced packaging.
More sensitive image sensors from visible to infrared
The project also advanced CMOS image sensor technologies, bridging the gap between research and industrial deployment:
-
New pixel concepts improved low-light and photon-counting performance, including Single-Photon Avalanche Diodes (SPADs) and Floating Transfer Gate (FTG) pixels.
-
A CMOS-compatible layer-exchange technology demonstrated increased sensitivity from the visible into the short-wave infrared range.
-
New high-speed, low-cost sensor test systems reduced characterization costs and support future sensor development.
These advances open opportunities in space and Earth observation, automotive sensing and LiDAR, scientific instrumentation, medical and life-science imaging.
Industrial, societal and ecosystem impact
IMAGINATION strengthens Europe’s position in broadcast technology, semiconductor inspection and imaging components, while also contributing to:
-
Higher industrial quality and productivity through faster and more accurate inspection systems
-
Reduced environmental impact via cloud-enabled and remote broadcast workflows
-
Long-term ecosystem development through standardisation activities, including CoaXPress, SMPTE and AMWA-NMOS
The project resulted in patents, demonstrators and contributions to international standards, and several partners continue collaboration in follow-up Xecs projects, ensuring that IMAGINATION’s results are carried forward into future products and markets.
To learn more about the project, its scope and outcomes, see the official Project Impact Summary.
Penta and Euripides² are Eureka Clusters, operated by AENEAS.