Hosted by the National Institutes of Applied Research (NIAR), imec, Europractice, and TU Dresden (TUD), the Taiwan–Europe Chip Innovation Forum 2025 (TECIF) brings together leading figures from industry, academia, and policy to explore the future of chip technologies.
This year’s edition focuses on three key pillars: Technology Innovation, Talent Cultivation, and Cross-Regional Collaboration. Featuring keynote presentations by ESMC and Synopsys, the Forum will address cutting-edge topics such as Advanced Packaging, Silicon Photonics, Smart Sensing, Advanced Devices, and Emerging Memory.
With a strong emphasis on semiconductor talent development, TECIF highlights the importance of linking technological excellence with education and skills, supporting a comprehensive and sustainable innovation ecosystem.
By encouraging knowledge exchange and strategic partnerships between Europe and Taiwan, the Forum strengthens the global semiconductor community and contributes to advancing shared innovation goals.
More information and registration: https://tecif.eu/
AENEAS actively supports such cross-border collaboration, fostering dialogue and joint initiatives that connect ecosystems across regions. Earlier last month, an AENEAS representative visited Taiwan to reinforce cooperation in semiconductor R&I — further building the bridges that events like TECIF continue to strengthen.