A Pre-Brokerage Workshop for Lab to Fab Accelerator projects on Advanced Packaging will take place on 18 September 2025, 15:30 – 17:30 CEST in Grenoble, France, at the World Trade Center (onsite only).
The session, organised by the EPoSS Working Group Advanced Packaging and hosted by the 25th European Microelectronics & Packaging Conference (EMPC 2025), will inform the community about the upcoming Chips JU Advanced Packaging calls and support the launch of project consortia.
🔹 Learn more about the draft call, published on 2 September 2025 – read it here
🔹 Exchange with peers and explore collaboration opportunities
🔹 Kick-start your Lab to Fab Accelerator projects
Register now to join the onsite workshop here.
If you cannot attend but wish to stay informed about the calls and funding opportunities, please contact the EPoSS Office.