The European Microelectronics and Packaging Conference (EMPC 2025) is the flagship international event dedicated to microelectronics packaging, organised by IMAPS-Europe and co-sponsored by IEEE-EPS. This renowned conference connects industry leaders, researchers, technologists, and business professionals across the entire microelectronics value chain.
The 2025 edition will feature a dynamic programme that addresses both current industrial trends and forward-looking academic innovations in semiconductor packaging and system integration. Topics of interest include:
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Advanced Packaging & System Integration: System-in-Package, IC Packaging, Interconnection, Optoelectronics
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Specialised Applications: Power, Medical, and Green Electronics; Sustainability
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Materials & Processes: Substrate Technologies, Assembly & Manufacturing, Smart and Emerging Technologies
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Design & Reliability: Simulation, Inspection, Quality, Test and Reliability
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Markets & Trends: Business Insights, Education and Workforce Development
EMPC 2025 provides a high-visibility platform for companies and institutions to showcase their technologies and services to a global audience. Over 40 organisations have already confirmed their participation—explore the EMPC 2025 website to secure your place among the leading players in microelectronics packaging.
Discover the programme and keynote speakers.