The Governing Board of The Key Digital Technologies Joint Undertaking has adopted the KDT work programme for the year 2023.
Launch of KDT JU 2023 calls
In 2023, the KDT JU will launch three calls for proposals: Call 2023-1 for Innovation Actions (higher TRLs) will consist of a global topic and 3 focus and run in 2 phases; Call 2023-2 for Research and Innovation Actions (lower TRLs) will consist of a global topic and one focus topic and run in 2 phases; Call 2023-3 will include three actions one RIA and two CSA that will be implemented as one phase call without national contribution.
The two global topics focus on all chapters of the SRIA and aim at the reinforcement of the industrial competitiveness, stimulating industrial innovation and transfer of innovation from research environments (RTOs and Universities) to SMEs and Large Enterprises. Research and Innovation Actions (RIA) and Innovation Actions (IA) essentially differ by the Technology Readiness Level (TRL) and therefore by the reimbursement rates. The third call will cover three actions: improving the global demand supply forecast of the semiconductor supply chain (IA); pan-European network for Advanced Packaging made in Europe (CSA); Coordination of the European software-defined vehicle platform (CSA).
KDT 2023 Calls Budget
The overall maximum EU operational budget for the KDT JU Calls 2023 is 317,7 millions euro. The participating states budget is still to be confirmed.
|Action||Topic||Estimated EU Expenditure (M€)|
|Call 2023-1-IA T1||Global call according to SRIA 2023 (IA)||153.0|
|Call 2023-1-IA T2||Focus topic 6G Integrated Radio Front-End for TeraHertz Communications (IA)||20.0|
|Call 2023-1-IA T3||Focus topic on Integration of trustworthy Edge AI technologies in complex heterogeneous components and systems (IA)||20.0|
|Call 2023-1-RIA T4||Focus Topic on Electronic Control Systems (ECS) for management & control of decentralized energy supply & storage (IA)||20.0|
|Call 2023-2-RIA T1||Global call according to SRIA 2023 (RIA)||76.7|
|Call 2023-2-RIA T2||Focus Topic on Hardware abstraction layer for a European Vehicle Operating System (RIA)||20.0|
|Call 2023-3-IA T1||Improving the global demand supply forecast of the semiconductor supply chain (IA)||5.0|
|Call 2023-3-CSA T2||Pan-European network for Advanced Packaging made in Europe (CSA)||1.0|
|Call 2023-3-CSA T3||Coordination of the European softwaredefined vehicle platform (CSA)||2.0|
Call 2023-1 and Call 2023-2 – two-stage process
Opening date: 7 February 2023 – opening of the portal funding and tender
Project Outline: 3 May 2023
Full Project Proposal: 19 September 2023