International Roadmap for Devices and Systems (IRDS™) 2021 Edition available

The IRDS mission is to identify the roadmap of electronic industry from devices to systems and from systems to devices.

IRDS STRUCTURE

This initiative focuses on an International Roadmap for Devices and Systems (IRDS) through the work of International Focus Teams (IFT) closely aligned with the advancement of the devices and systems industries. Led by the International Roadmap Committee (IRC), IFTs collaborated in the development of the 2021 IRDS roadmap, and engaged with other segments of the IEEE, such as the Rebooting Computing Initiative (RCI), Electron Devices Society (EDS), Computer Society (CS), Communication Society (ComSoc), and also with related industry and academic communities like the System and Device Roadmap Japan (SDRJ) and the European SINANO Institute (ESI) in complementary activities to help ensure alignment and consensus across a range of stakeholders.

IRDS Scope

The scope of the IRDS™ of the fundamental building blocks in the electronics industry spanning from devices to systems and from systems to devices, in which the AI–centric IoT–social–infrastructures with high–speed network communication will be built on the semiconductor device and process technologies.

Currently, IRDS has 13 IFTs with supplemental information on the market drivers (i.e., automobile, medical devices) in the IT eco–systems, as follows: AB: Applications Benchmarking, SA: Systems and Architecture, OSC: Outside system Connectivity, MM: More Moore, BC: Beyond CMOS, CEQIP: Cryogenics Electronics and Quantum Information Processing, PI: Packaging Integration, FI: Factory Integration, L: Lithography, YE: Yield Enhancement, M: Metrology, ESH/S: Environment, Safety, Health, and Sustainability, MtM: More than Moore, MDs: Market drivers (automobile, medical devices).

International Focus Teams (IFT)Roadmap Reports

Here are the available IFT reports:

• Systems and Architectures
• Outside Systems Connectivity
• More Moore
• Lithography
• Yield enhancement
• Metrology
• Beyond CMOS
• Cryogenic Electronics and Quantum Information Processing
• Factory integration

White Paper “More than Moore”

The objective of the white paper is to provide an overview of a number of technology/application areas that are representative for the More than Moore domain in the sense that they require multifunctional heterogeneous system solutions, rather than miniaturization of devices only. These are:
• Smart sensors,
• Smart energy,
• Energy harvesting and
• Wearable and flexible electronics.

White Paper summary

Flexible electronics has experienced an enormous growth in the last years and is expected to be used in an increasing electronics number of products as the technology continues to advance. As substrates become thinner, devices become thin, light, and flexible. A higher increase of flexible electronics applications is foreseen in the coming years due to the expansion of the Internet of Things, which requires low–cost, lightweight and flexible and wearable technologies. The market of flexible and printed electronics and is expected to reach over $73 billion by 2025.

Components used or to be used in flexible electronics, such as TFTs, OLEDs and OPVs have considerable improved their performances in the last years. However, further expansion of flexible electronics needs to surmount several technological challenges, including improvements in mobility, environmental stability, bias and light stress reduction, thermal conductivity, biodegradable substrates, and incorporation in crystalline and rigid electronics. Several solutions to overcome these challenges have been proposed, and the performance improvements are expected to continue in the
coming years.

Read the full White Paper here.