COREnect had a strong presence at the EuCNC & 6G Summit, from the 8th until the 11th of June 2021
• COREnect Workshop “Hardware Enabling Technologies for 6G Networks”
Tuesday, 8 June 2021, 14:00-15:30/16:00-17:30 CEST
The purpose of the workshop moderated by Jacques Magen (Australo) was to present the key findings of the COREnect Expert Groups.
Colin Willcock, from 5GIA, – “Hardware enabling technologies to ensure EU’s digital autonomy in 6G networks: The COREnect approach”. Find the presentation here.
Patrick Pype, from NXP, – “Electronics for Trustworthy Communication (6G and beyond)”. Find the presentation here.
Piet Wambacq, from IMEC, – “Future Core Technologies and Integration”.Find the presentation here.
Patrick Cogez, as a panelist represented the industry and discuss whether cross-industry collaboration between telecom and microelectronics can benefit both industry and both SNS and KDT partnerships.
- COREnect Panel “Components and Hardware on the Road to 6G”
Thursday, 10 June, 11:30-13:00 CEST
This panel, moderated by the COREnect coordinator prof. Gerhard Fettweis (Vodafone Chair Professor, TU Dresden, DE), elaborated on the first COREnect’s findings and results related to the expected role of microelectronics in 6G. Ideas and recommendations on strategic measures to address these challenges, as well as the potential roles of the various stakeholders in such future 6G ecosystems were discussed.
Caroline Bedran (Director General, AENEAS, introduced the introduce the major technological challenges and opportunities for Europe on the road to 6G. Find the video of the presentation here.
Björn Ekelund (Corporate Director, Hardware, Device, and Electromagnetics Research, Ericsson, SE). Find the video of the presentation here.
Lars Reger (EVP and CTO, NXP semiconductors, NL). Find the video of the presentation here.
Thomas Kropf (President, Corporate Research and Advanced Engineering, Robert Bosch GmbH, DE). Find the video of the presentation here.