SEMI Applauds launch of EU Pact for Skills to Mobilize 2 Billion EURO Investment in Microelectronics Talent.
To read the full press release including the quotes from Laith Altimime, , Sabine Herlitschka, Luc Van den hove, and Frits van Hout, please click here.
The ambition of the Pact for Skills is to build the most powerful, cutting edge and sustainable microprocessors and advance Europe’s leadership in key areas –quantum computing, Edge AI, 5G, connected, autonomous and electric mobility, smart energy and Industry 4.0 to name a few. Continuous investment in skills and ensuring that Europe has the right talent, both qualitatively and quantitatively, is not a choice, but a prerequisite to realize the ambition. The time needed to develop the talent pipeline with hands-on experience to build cutting edge electronic components and systems take considerable amount of time, calling for an urgent action.
Building on the momentum created over the past years in Europe’s microelectronics ecosystem, the Pact will be instrumental in setting up new and upgrading existing teaching facilities, training equipment and digital education infrastructure; launching attractive image campaigns and awareness activities making “Europe’s electronics brand” more attractive; improving skills intelligence and preparing for the future of work via pan-European partnerships; promoting best practices; and delivering training programmes at regional level via innovation hubs.
High-tech companies across the world are progressively investing in skills to remain competitive. The cost of training and development in electronics is increasing aligned with the new skills required. For the afore-mentioned proposed initiatives underpinning the ambition of the initial members of the partnership (seethe list annexed), it is estimated that an investment of €400m annually will be needed under the Pact. Representing a new wave of €2binvestmentfrom public and private sides for the 2021-25 period in total, the proposal will significantly contribute to the current and future workforce in Europe. The activities foreseen under the Pact will reach out to at least 50,000 workers and students each year on average and provide new re/upskilling opportunities in the field of electronic components and systems for more than250,000 people in five years. The Pact will be implemented with a bottom-up approach with pilot projects in Europe’s electronics clusters.
To read the Pact for Skills –Skills Partnership for Microelectronics- November 2020-, please click here.